| abstract |
A polishing liquid is provided, which includes abrasive grains and a surfactant. The abrasive grains contain a first colloidal silica having an average primary particle diameter of 45-80 nm and a second colloidal silica having an average primary particle diameter of 10-25 nm. The weight w 1 of the first colloidal silica and the weight w 2 of the second colloidal silica satisfy the relationship represented by the following expression 1. n 0.63≦ w 1 /( w 1 +w 2 )≦0.83 Expression 1 |