| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82b16d7cc0e7f65520cb706020819468 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate |
2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c63ba96b06ef4175ac3bd5c2da47714f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4dc53109bf37d216e5f0095d19e18a6e |
| publicationDate |
2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009061241-A1 |
| titleOfInvention |
Tin electrolytic plating solution for electronic parts, method for tin electrolytic plating of electronic parts, and tin electroplated electronic parts |
| abstract |
A tin electrolytic plating solution comprises a suitably selected nonionic surfactant having a branched alkyl group. The nonionic surfactant is contained either alone, or with a suitably selected cationic surfactant and/or a suitably selected alkyl imidazole. The invention also provides a tin electrolytic plating method using such a tin electrolytic plating solution, and a tin electroplated electronic part obtained by such a method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I728217-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10864567-B2 |
| priorityDate |
2007-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |