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filingDate 2008-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a74f63668380259937073c241f2f83d
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publicationDate 2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2009058455-A1
titleOfInvention Test structure and test method
abstract The present invention discloses a wafer level test structure and a test method; in which, a heating plate is formed on the wafer for heating a structure to be tested positioned above or adjacent to the heating plate. The heating plate produces heat by electrically connecting to a current. Thus, the heat provided by the heating plate and the electric input/output into/from the structure to be tested are controlled separately and not influenced each other.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013193997-A1
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Total number of triples: 38.