| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-567 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-50 |
| filingDate |
2008-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4edcf40a19c1792d8a57a69cb7c1c4f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d19925cefdaeb3eff5a64d2bc374d97d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fec6fdba854a865e3c500dfc33c69096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d83fedca976311b87a9b4e1898557919 |
| publicationDate |
2009-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009038950-A1 |
| titleOfInvention |
High speed method for plating palladium and palladium alloys |
| abstract |
A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8500983-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9385035-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012244276-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010300888-A1 |
| priorityDate |
2007-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |