| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed52792ee6ebea0048b938a02239e348
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eda0e7b246768cf64708107f0d300da3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_05d10ec2a9b5738c2a77c9132bd9e943 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-16 |
| filingDate |
2004-07-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c619034b0f43432a7cf2261b61707e96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_374d201303d6ccc517fdeec9ead2f7ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d25145b3589bdc68d56f6d6ffc1cfd41 |
| publicationDate |
2009-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009020437-A1 |
| titleOfInvention |
Method and system for controlled material removal by electrochemical polishing |
| abstract |
A method and apparatus for electropolishing a conductive layer on a wafer is provided. The apparatus includes an electrode and a conductive member having openings permitting an electropolishing solution to flow through it. Surface of the conductive member includes a surface profile. During the electropolishing process, the surface of the conductive element is placed across from the conductive layer and a potential difference is applied between the conductive layer and the electrode. The process forms a conductive layer profile of the conductive layer. |
| priorityDate |
2000-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |