| abstract |
Disclosed is a resin composition composed of a heat-treated resin component (A) obtained by heating and mixing an aromatic imide resin or an aromatic imidazole resin with a carboxylic acid anhydride, and a silane compound (B) having at least one functional group selected from the group consisting of an epoxy group, an amino group, an amide group, a methoxy group, an isocyanate group, a carboxyl group, a mercapto group, a vinyl group, a (poly)sulfide group and a methacrylo group. This resin composition has excellent heat resistance of aromatic imide resins and aromatic imidazole resins while being remarkably improved in adhesion to various bases. |