http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009014880-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76808 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
filingDate | 2008-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9838141f279fb1a5f89579c7aab3dff http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8db9a767f30e5602cc03f7d25f1e5803 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c7aff5da971b0058d67d07bf29d18f7 |
publicationDate | 2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2009014880-A1 |
titleOfInvention | Dual damascene process flow enabling minimal ulk film modification and enhanced stack integrity |
abstract | Interconnect structures possessing an organosilicate glass interlayer dielectric material with minimal stoichiometeric modification and optionally an intact organic adhesion promoter for use in semiconductor devices are provided herein. The interconnect structure is capable of delivering improved device performance, functionality and reliability owing to the reduced effective dielectric constant of the stack compared with that of those conventionally employed because of the use of a sacrificial polymeric material deposited onto the dielectric and optional organic adhesion promoter during the barrier open step done prior to ashing the patterning material. This sacrificial film protects the dielectric and optional organic adhesion promoter from modification/consumption during the subsequent ashing step during which the polymeric film is removed. |
priorityDate | 2006-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.