http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008318137-A1

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publicationDate 2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008318137-A1
titleOfInvention Lithography masks for improved line-end patterning
abstract In one embodiment, a mask for use in semiconductor processing comprises a first region formed from a first material that is primarily opaque, a second region formed from a second material that is primarily transmissive, and a third region in which at least a portion of the second material is removed to generate a phase shift in radiation applied to the mask.
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