| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b86357fa6e8b130b3e17c7f8e56856f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0786 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C59-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-149 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20 |
| filingDate |
2006-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91a4c263c076369d6cafffc97f4f91ff
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_739389efe59eefb9f4ee5a531c95c2ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76c7311482ab6b88ee3024beeec5f818 |
| publicationDate |
2008-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008318070-A1 |
| titleOfInvention |
Water-Soluble Preflux and Usage of the Same |
| abstract |
It is an object to provide a water-soluble preflux containing a low-volatile solubilizing agent excellent in performance to dissolve an imidazole compound in water and capable of bringing out an excellent film-forming property of the imidazole compound and also to provide a treating method for the surface of a metal conductive part which comprises bringing the surface into contact with the above water-soluble preflux. n Another object is to provide a printed wiring board wherein the surface of a metal conductive part has been brought into contact with the above water-soluble preflux and a soldering method which comprises bringing the surface of a metal conductive part into contact with the above water-soluble preflux and subsequently soldering the surface. n A water-soluble preflux comprising an imidazole compound and a carboxylic acid compound having 4 to 16 carbon atoms represented by the following general formula 1: n n n n n n n n n n wherein R 1 represents a linear or branched alkyl group having 1 to 4 carbon atoms, R 2 represents a hydrogen atom or a methyl group, m represents an integer of 0 to 3, and n represents 1 or 2. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11021430-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3441382-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10988649-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012067619-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10961422-B2 |
| priorityDate |
2005-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |