http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008308524-A1

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filingDate 2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008308524-A1
titleOfInvention Electrochemical Fabrication Methods With Enhanced Post Deposition Processing
abstract An electrochemical fabrication process for producing three-dimensional structures from a plurality of adhered layers is provided where each layer comprises at least one structural material (e.g. nickel) and at least one sacrificial material (e.g. copper) that will be etched away from the structural material after the formation of all layers have been completed. A copper etchant containing chlorite (e.g. Enthone C-38) is combined with a corrosion inhibitor (e.g. sodium nitrate) to prevent pitting of the structural material during removal of the sacrificial material. A simple process for drying the etched structure without the drying process causing surfaces to stick together includes immersion of the structure in water after etching and then immersion in alcohol and then placing the structure in an oven for drying.
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