http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008306220-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12569 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31681 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G61-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-21 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2008-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e6190cc58869aa8800bde44f1a30f53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1796445e063ba17e107e08bd93cdd8e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4c6c69327fb384e8989f69a19a4f3da http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5cd85b939eb620d671735b4d0aad669 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_75b830548e24d9ae0146f492398d1124 |
| publicationDate | 2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2008306220-A1 |
| titleOfInvention | Thermosetting Resin Composition, Multilayer Body Using Same, and Circuit Board |
| abstract | The present invention relates to thermosetting resin compositions which are suitably used for manufacturing circuit boards, such as flexible printed circuit boards (FPCs) and build-up circuit boards, and to multilayer bodies and circuit boards manufactured using such thermosetting resin compositions. n A thermosetting resin composition contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C). The mixing ratio by weight (A)/[(B)+(C)] is in a range of 0.4 to 2.0, the mixing ratio by weight being the ratio of the weight of the component (A) to the total weight of the component (B) and the component (C). By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, adhesiveness, processability, heat resistance, flowability, etc. n A thermosetting resin composition contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E). The phosphazene compound (D) includes a phenolic hydroxyl group-containing phenoxyphosphazene compound (D-1) and/or a crosslinked phenoxyphosphazene compound (D-2) prepared by crosslinking the 4 phenoxyphosphazene compound (D-1), the crosslinked phenoxyphosphazene compound (D-2) having at least one phenolic hydroxyl group. By using such a thermosetting resin composition, it is possible to manufacture multilayer bodies and circuit boards which are excellent in dielectric characteristics, processability, heat resistance, and flame retardance. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I452064-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012158415-A1 |
| priorityDate | 2003-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 1486.