| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f24c1bbcfb7a5747af82e61209a5bcdb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4eacd94073c0dff82f4fc0fee23c87fa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ae8a4d8d32d5402d6b224a196a15d19f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_614532063b48105f45b2ac7e9d536d73 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S425-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76817
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-38 |
| filingDate |
2008-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fd18cb627a6104a7f87bfeb452d85ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_febd524c763cbc973d27ab6bd1942ba4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3057bf19d13c881cfeda0b23e006d05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83a488d06ace6f6c09062aebafcce6c2 |
| publicationDate |
2008-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008303160-A1 |
| titleOfInvention |
Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning |
| abstract |
The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10580649-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9006898-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10879595-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012013011-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9589797-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10682805-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8586472-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015179182-A1 |
| priorityDate |
2004-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |