| abstract |
An electronic component including, on one surface of a substrate ( 1 ), a plurality of circuit elements and external terminals each consisting of a conductive protrusion ( 9 ) for the circuit elements is provided with a structure capable of resisting an external force after mounting. Each of the circuit elements includes, as constituent elements, a pair of electrodes ( 2 ) and a resistive element ( 3 ) or a dielectric contacting with the pair of electrodes ( 2 ), each circuit element is covered with an overcoat ( 7 ) while the electrodes ( 2 ) are partially exposed as lands ( 4 ), the conductive protrusion ( 9 ) includes a fixedly bonding member, the conductive protrusion ( 9 ) is fixedly bonded to each of the lands ( 4 ) by the fixedly bonding member, at least three lands ( 4 b ) of the lands ( 4 ) are larger in area than the other lands ( 4 a ), the electronic component can stand alone while the conductive protrusion ( 9 ) contacts with a flat if the conductive protrusion ( 9 ) is fixedly bonded only to each of the larger-area lands ( 4 b ), and the conductive protrusions are all formed by fixedly bonding conductive balls ( 10 ) substantially equal in size to entire surfaces of the respective lands ( 4 ). |