| abstract |
In a method and system for fabricating a semiconductor device ( 100 ) having a package-on-package structure, a base laminate substrate (BLS) ( 110 ) is formed to include a base center portion ( 112 ) and a peripheral portion ( 114 ) separated by a barrier element ( 120 ). The barrier element ( 120 ) forms a peripheral wall ( 118 ) to surround the base center portion ( 112 ). A frame shaped top laminate substrate (TLS) ( 130 ) is disposed over the peripheral portion ( 114 ) of the BLS ( 110 ). The TLS ( 130 ) has an open top center portion ( 132 ) matching the base center portion ( 112 ) surrounded by the peripheral wall ( 118 ) to form a cavity ( 140 ). A plurality of conductive bumps ( 150 ) each disposed between a top contact pad ( 134 ) of the TLS and a base contact pad ( 116 ) of the peripheral portion ( 114 ) of the BLS ( 110 ) are formed to provide electrical and mechanical coupling therebetween. The barrier element ( 120 ) forms a seal between the cavity ( 140 ) and the plurality of conductive bumps ( 150 ). |