| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_38ed56a4b4e8e2315b2b3308bffedb3f |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76883 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311 |
| filingDate |
2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6096be95d806b08951875daca76696be
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27d5e02520f3050ff3402fd7bc1a17f6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_acad4ae909676cc30968609bc74cb87d |
| publicationDate |
2008-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008280449-A1 |
| titleOfInvention |
Self-aligned dielectric cap |
| abstract |
A method of forming a dielectric layer includes providing a substrate that has a copper region and a non-copper region. The substrate is etched to remove any copper oxides from the copper region. A dielectric cap is then selectively formed over the copper region of the substrate so that little or no dielectric cap is formed over the non-copper region of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10515896-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019067194-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8404582-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020294789-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011139417-A3 |
| priorityDate |
2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |