| abstract |
The present invention provides a curable composition comprising (a) a vinyl-based polymer containing, in its molecule, at least one alkenyl group which can be hydrosilylated, and having a number average molecular weight of 500 to 1,000,000, (b) a hydrosilyl group-containing compound and (c) a silicone powder, and a sealing method using the curable composition. According to the invention, there can be provided a curable composition excellent in on-site formability, excellent in heat resistance, chemical resistance and oil resistance, and low in compression set. |