| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24051
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32506
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-24 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49 |
| filingDate |
2008-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e2dd51a09bc4cef725c0866cf2fa2034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ae0ca3dab760fb7eb53009444707bb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20b899f97d4ea05030b87e8c96ca2c1f |
| publicationDate |
2008-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008265431-A1 |
| titleOfInvention |
Semiconductor package and method of manufacturing the semiconductor package |
| abstract |
A semiconductor package and a method of manufacturing the package are provided. The semiconductor package comprises: a mounting substrate including a bond finger; at least one semiconductor chip disposed on the mounting substrate, the semiconductor chip including a bonding pad; a first molding member disposed on the mounting substrate so as to cover the bond finger and the bonding pad, the first molding member including an interconnection path disposed inside the first molding member so as to connect the bond finger to the bonding pad; a conductive element disposed in the interconnection path; and a second molding member overlying the first molding member. The interconnection path can be formed by a laser process. The conductive element can be formed by conductive nanoparticles or metal wires. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106881535-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009032972-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10347508-B2 |
| priorityDate |
2007-04-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |