patent/US-2008265407-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008265407-A1

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1579 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29299
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3735 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-31
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34
filingDate	2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c390240f9f56a832cdcca4a192c91972 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e886100e01ac3ded8185f18aa7116c08
publicationDate	2008-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2008265407-A1
titleOfInvention	Wafer-level bonding for mechanically reinforced ultra-thin die
abstract	An embodiment of the present invention is a technique to fabricate a package. A metal sheet having trenches is formed. A thinned wafer supported by a wafer support substrate (WSS) is formed. The metal sheet is bonded to the WSS-supported thinned wafer to form a metal bonded thinned wafer. The thinned wafer is diced to the trenches into die assemblies.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008001268-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012194296-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9082871-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10332931-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8063482-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8642386-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2665096-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8987904-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008142954-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9608035-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013171002-A1
priorityDate	2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7023089-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006015674-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 62.