| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_76dfa1056bb33e104ccd56d0e3b4035c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_65f18afc4587914660839ba73f661a70 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-283 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8b6d854c7942e2e49c8bba129a1c1a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1cbdd22dc616aa62c9e62b2ee65a5096 |
| publicationDate |
2008-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008242079-A1 |
| titleOfInvention |
In-situ formation of conductive filling material in through-silicon via |
| abstract |
The formation of electronic assemblies including a die having through vias is described. In one embodiment, a method includes providing Si die including a first surface and a second surface opposite the first surface, and forming a via extending through the Si die from the first surface to the second surface. The via is formed to have a larger width at the first surface than at the second surface, the larger width at the first surface being no less than 100 microns. The method also includes placing a plurality of particles in the via, wherein at least some of the particles comprise a polymer and at least some of the particles comprise a metal. The method also includes heating the die and the particles in the via to cross-link at least part of the polymer in the via, and cooling the die to solidify the polymer and form a electrically conductive composite including the cross-linked polymer and the metal in the via. Other embodiments are described and claimed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9717145-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014194049-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011219612-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9003654-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009321892-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8456017-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2365741-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101083042-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/FR-2957480-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8618637-B2 |
| priorityDate |
2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |