| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e7e0e42cba4bee6c48312821708b5d3a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C35-0888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2035-0838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C2059-023 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C37-0067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C59-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C59-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C59-16 |
| filingDate |
2007-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e51ebc439afbc885bff7e59fcd5b33a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f469c669b226729381b281adf17a5d8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f51a244205d4b30483b082c79df32ca1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1d0f1017720e6880fec1ae3c67b21a6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fcea917b43782cb94a1fb8aaebd1a14d |
| publicationDate |
2008-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008217819-A1 |
| titleOfInvention |
Micro/Nano-Pattern Film Contact Transfer Process |
| abstract |
A micro/nano-pattern film contact transfer process is described, comprising: providing a mold, wherein an imprinting pattern is set in a first surface of the mold; forming a release layer on the first surface of the mold and a transfer material layer on the release layer; providing a substrate; placing the mold on a first surface of the substrate, wherein the first surface of the mold is opposite to the first surface of the substrate; applying a pre-pressed force on the substrate from a second surface opposite to the first surface of the substrate; providing a heating source to heat the transfer material layer to produce an adhesion effect between a portion of the transfer material layer contacting with the first surface of the substrate and the substrate; and removing the mold, wherein the contacting portion of the transfer material layer is transferred onto the first surface of the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10046360-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011008484-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8147704-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101472682-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011004991-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015012554-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010193469-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10624248-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108713356-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8608468-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013213690-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017295679-A1 |
| priorityDate |
2006-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |