| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_976c95846d8985204174fa0f6d0093b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e67f6ed1c7ea32fbec78c7d2d6152c5e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_53bffc7ea8787d354f7a467ad4f215d6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2f40c03d5bd5c161b385128353353399
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f0c54f5f208bb2eb8f397ce6a2f40fd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2800-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F226-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-10 |
| filingDate |
2006-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1144b79bb84774f7b320ecf1c39a514d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c1657a789f2f96b63720296ad5faecb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_310f3a2b87f91a497aa3f2f9d81c640d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97470bbb17a15be4ff78663e8eda8681
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1f0930fa6a96fb973efac1efd169a6f |
| publicationDate |
2008-09-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008210569-A1 |
| titleOfInvention |
Polyvinylammonium Compound, Method of Manufacturing Same, Acidic Solution Containing Said Compound and Method of Electrolytically Depositing a Copper Deposit |
| abstract |
The invention relates to a polyvinylammonium compound, to a method of manufacturing said compound, to an aqueous acidic solution containing at least said Polyvinylammonium compound for electrolytically depositing a copper deposit as well as to a method of electrolytically depositing a copper deposit using said aqueous acidic solution, said polyinylammonium compound corresponding to the general chemical formula (1): as well as to polyvinylammonium compounds of the general chemical formula (1), wherein one of the monomer units or both having indices l and m are present in the neutral form. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008102608-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8574420-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7557049-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10767275-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009105375-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012065616-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105316715-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3415664-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018228821-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11174566-B2 |
| priorityDate |
2005-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |