| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_556c0faf1bce53b036be40f0509348b5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06F1-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3675 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F25D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34 |
| filingDate |
2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_69e5664045ca082a6be7bb66fa6cd742 |
| publicationDate |
2008-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008190119-A1 |
| titleOfInvention |
Package for housing a semiconductor chip and method for operating a semiconductor chip at less-than-ambient temperatures |
| abstract |
A package for housing a semiconductor chip is described. In one embodiment, the package comprises an insulation body encasing the semiconductor chip, wherein the insulation body is in direct contact with the front surface of the semiconductor chip. A refrigeration device is connected with the back surface of the semiconductor chip and is for removing substantially more heat from said semiconductor chip than the heat removed from the semiconductor chip by the insulation body. In another embodiment, a method for operating a semiconductor chip comprises cooling the semiconductor chip to a first less-than-ambient temperature by activating a refrigeration device of a package that houses the semiconductor chip. Subsequently, power is provided to the semiconductor chip, heating the semiconductor chip to a second less-than-ambient temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10787303-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9564386-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016064307-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014366559-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-D811802-S
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9909789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11078007-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9416995-B2 |
| priorityDate |
2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |