| abstract |
The present invention is directed to a fast break-in polishing pad, which chemically and/or physically allows for a high rate of absorption of water and/or chemical slurry by decreasing the maximum absorption distance into the pad. In a preferred embodiment, this decrease in distance is achieved by forming a plurality of holes in the pad. In a preferred embodiment, the distance between the hole edges is no greater than twice the pad thickness. In other exemplary embodiments, the maximum distance can be decreased by applying a chemical foaming agent to the open-air mix while in the liquid phase. In another exemplary embodiment, the maximum distance can be decreased by including the addition of a cell-opening surfactant applied to the open-air mix while in the liquid phase. In another exemplary embodiment, the maximum distance can be decreased by directly injecting microbubbles into the open-air mix while in the liquid phase. |