| abstract |
Methods and devices for cooling printed circuit boards having at least one heat source are disclosed and described. Such a device may include a dielectric layer disposed onto a surface of a substrate. The dielectric layer may include a plurality of carbonaceous particles disposed in a dielectric material. In one aspect, the carbonaceous particles may be diamond particles. Furthermore, a circuit including a heat source may be disposed onto a surface of the dielectric layer opposite to the substrate such that the circuit is thermally coupled to the dielectric layer. Additionally, the dielectric layer may be configured to accelerate heat generated by the heat source away from the heat source. |