| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2006-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a03ad49f8b267a10c59321ec60821b3b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0a2943cf6eee67edf6838c203c524437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11943572d96af50aeddb53d514c5e678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4c4df4471c1fce5a5ecf3f04d47cc1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0b3febf3719dd6c0f91dc1a15bd6ca03 |
| publicationDate |
2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008111237-A1 |
| titleOfInvention |
Semiconductor device manufactured using an electrochemical deposition process for copper interconnects |
| abstract |
A method of manufacturing a semiconductor device that comprises forming an insulating layer over a semiconductive substrate 110 and forming a copper interconnect. Forming the interconnect includes etching an interconnect opening in the insulating layer and filling the opening with copper plating. Filling with copper plating includes using a first and second ECD. An electrolyte solution of the first and second ECD contains organic additives, and a current of the first ECD is greater than a current of the second ECD. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013104368-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10050102-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9160300-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013213816-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013093537-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9714474-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017207298-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013104368-B4 |
| priorityDate |
2006-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |