| abstract |
An integrated circuit package includes: an integrated circuit having a surface at least partially covered by a metal layer; at least one connection point; at least one connector electrically connecting the integrated circuit with the at least one connection point; and encapsulating material encapsulating the at least one connector, at least some of the integrated circuit and at least some of the at least one connection point, such that a contact surface of the at least one connection point and the metal layer on the integrated circuit are exposed outside the encapsulating material. |