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filingDate 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_010bb2feee7f0b3cd12735995c9ab13c
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publicationDate 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008073776-A1
titleOfInvention Sintered metallic thermal interface materials for microelectronic cooling assemblies
abstract A microelectronic cooling assembly and method for fabricating the same are described. In one example, a microelectronic cooling assembly includes a microelectronic device, a heat spreader, and a thermal interface material (TIM) that thermally joins the microelectronic device and heat spreader, the TIM comprising a sintered metallic nanopaste.
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