http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008070012-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dc39ea7449ed4b32e3a3142ad801f256 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0206 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate | 2006-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_372b4dfb7d22bca93b47b5780a8145a5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf88aaf9b801d382107eefeb7f6dd11b |
| publicationDate | 2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2008070012-A1 |
| titleOfInvention | Carrier board and method for manufacturing the same |
| abstract | A carrier board has a copper substrate, an insulating layer, a copper layer, multiple recesses and a metal circuit layer. The substrate has at least one through hole. The insulating layer is a layer of glue that is insulating, acid-resisting and high-temperature-resisting and is mounted in the at least one through hole and mounted on the substrate. The copper layer is mounted on the insulating layer. The recesses are formed in the copper layer and the insulating layer that is mounted on the substrate. The metal circuit layer is plated on copper layer and along the recesses to contact with the substrate. A heat from the metal circuit layer will transmit to the insulating layer by the copper layer and to the copper substrate. Thus, the carrier board has a heat-dissipating effect without combining with a dissipating apparatus, so LEDs packaged with the carrier board have a small dimension and are compact. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10433418-B2 |
| priorityDate | 2006-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.