| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-673
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B44C1-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/D06N7-04 |
| filingDate |
2007-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386a14b6bf94e3f8b172391c0afef1f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65b84753fbc89947fd9ff7533b0108d3 |
| publicationDate |
2008-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008063838-A1 |
| titleOfInvention |
Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape |
| abstract |
A film carrier tape for mounting electronic components has a wiring with a wire pitch of 35 μm or less. A method for manufacturing such film carrier tape is also disclosed. The film carrier tape for mounting electronic components is manufactured using a specific flexible conductor foil clad laminate as a wiring forming material. The flexible conductor foil clad laminate includes a base film and a conductor foil having a surface roughness (Rz jis ) of a bonded surface of 2.5 μm or less and a surface roughness (Rz jis ) of a resist-side surface of 1.0 μm or less. The flexible conductor foil clad laminate may be a flexible copper clad laminate in which a glossy-surface-processed electrolytic copper foil has a surface roughness (Rz jis ) of a bonded surface of 2.5 μm or less and a surface roughness (Rz jis ) of a resist-side surface of 1.5 μm or less and in which the copper foil is half etched as required to not less than half an original thickness. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009286072-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9232636-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012316825-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015245470-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9715077-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9707706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022061162-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10031313-B2 |
| priorityDate |
2006-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |