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publicationDate 2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008054461-A1
titleOfInvention Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor device
abstract A wafer level chip scale package (WLCSP) includes a packaged semiconductor device with a plurality of solder bump pads, patterned passivation regions above each of the solder bump pads, a patterned under bump metallization (UBM) region on each of the solder bump pads and the passivation regions, a polyimide region over a portion of the UBM regions and the passivation regions, solder bumps formed on each of the UBM regions, and encapsulation material surrounding the semiconductor die except for at least a portion of each of the solder bumps.
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