| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d42d6ca4641b20d2c090d6bee4fa47ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4aacafe8a6bf3f8b28a46678f3d51c25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_665bbbea46b9c1f7034bd0ea0fb96dd0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_71cd4059fe29d9cb0e8be7ab43dbd29b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2007-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d46894d538bfaac8627ed6eb51b5a8fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_391633d12254577d2189c9a8c63bd8b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6b79b2c0f59766764698acc6dec656c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c163b20eb5fd1b8aacf8fb6703ac0eac |
| publicationDate |
2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008053002-A1 |
| titleOfInvention |
Solution for forming polishing slurry, polishing slurry and related methods |
| abstract |
A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1 H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching. |
| priorityDate |
2006-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |