http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008013281-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_61155939891010276932bda73b832c00
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20
filingDate 2006-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a31e6b45ad7f00db19c2b2bd5099e8be
publicationDate 2008-01-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008013281-A1
titleOfInvention Cooling method use diamond pins and heat pipes
abstract An apparatus for cooling a microprocessor includes a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid; at least one configurable diamond pin; at least one heat pipe; and a heat sink structure. At least one diamond pin is configured to displace junction temperature on a hot spot location of the microprocessor. The heat sink structure and at least one heat pipe are configured atop the second thermal interface material layer. In a method of cooling a microprocessor including a first thermal interface material layer; a lid that encases the first thermal interface material layer and the microprocessor; a second thermal interface material layer applied to a top of the lid, the method includes disposing at least one configurable diamond pin at a hot spot location of the microprocessor; and configuring a heat sink structure and at least one heat pipe atop the second thermal interface material layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105135976-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015150717-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017252219-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11264306-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016220265-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8953314-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9831151-B1
priorityDate 2006-07-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7206203-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4226281-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4546405-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007144182-A1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559541
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166598
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449871035
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123

Total number of triples: 29.