| abstract |
A method of manufacturing a thin TFT over a flexible substrate is provided. In formation of a TFT on a surface of a substrate having heat resistance, a liquid repellent film is formed selectively on a surface of the substrate, and an organic film is formed thereover. An element such as a TFT is formed over the organic film. Since the liquid repellent film is formed over the substrate, adhesion between the substrate and the organic film is low; therefore, the element which is formed can be peeled off from the substrate easily. Further, since the element is not transferred to another substrate, a semiconductor device which is thinner than conventional ones can be manufactured. In order to form the liquid repellent film selectively, light exposure of a front surface or a back surface of the substrate provided with a mask, a droplet discharging method, or the like is used. |