| abstract |
In a method and system for fabricating a leadframe ( 100 ), a thickness of bondable areas ( 150, 152 and 154 ) of the leadframe ( 100 ) is reduced. A plating finish ( 160 ) is applied to a surface of the leadframe ( 100 ), including the surface of the bondable areas ( 150, 152 and 154 ) to provide a smooth texture. A selective portion ( 102 ) of the surface is removed by grinding off the plating finish ( 160 ) on the selective portion ( 102 ) to provide a rough texture while substantially preserving the smooth texture on the bondable areas ( 150, 152 and 154 ). Removal of the plating finish ( 160 ) on the selective portion ( 102 ) causes the selective portion ( 102 ) to form the rough texture, compared to the smooth texture of the plating finish ( 160 ). The rough texture provides increased adhesion to a polymeric compound compared to an adhesion provided by the smooth texture. Bondability of the bondable areas ( 150, 152 and 154 ) is maintained by preserving the smooth texture of the plating finish ( 160 ). |