| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87601f67652231739bdbad18d86703d2 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0083 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 |
| filingDate |
2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_728dc80687acdbbd27b962f6365e6531 |
| publicationDate |
2007-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007290222-A1 |
| titleOfInvention |
Semiconductor light emitting device and method of fabricating the same |
| abstract |
The present invention provides a flip chip semiconductor light-emitting device which includes a substrate and a semiconductor multi-layer structure. The semiconductor multi-layer structure has a first surface and a second surface in opposition to the first surface. The semiconductor multi-layer structure is bonded to the substrate by the first surface. In addition, the second surface has a plurality of convex. More particularly, the plurality of convex is arranged in a periodic structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8124992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11137661-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011127551-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8513688-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010052007-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109390282-A |
| priorityDate |
2006-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |