| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7e9bcfdc70c901a3bd71f6f4f1458591
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d10ef6d7d310a2706b6814a5df1227b0 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1653
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-208 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 |
| filingDate |
2005-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f02eb6a3c40ae40bc604694ca7c86e22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_794cde4e52a529ced0b483eafa5cee93 |
| publicationDate |
2007-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007269680-A1 |
| titleOfInvention |
Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible Substrate |
| abstract |
Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104789949-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008014362-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012192758-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111511962-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11761091-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I548650-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010189974-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007120880-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9518324-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10021789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019063773-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7713340-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9499912-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8814997-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110527990-A |
| priorityDate |
2004-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |