| abstract |
An electroless plating film with high adhesive strength is formed on surfaces of polymer substrates of various kinds, at low cost by providing a method of manufacturing a polymer member, including: preparing a polymer substrate having metallic fine particles impregnated on and inside a surface thereof; bringing pressurized carbon dioxide into contact with the polymer substrate to swell a surface area of the polymer substrate; and bringing an electroless plating solution containing pressurized carbon dioxide and being in a state causing a plating reaction, into contact with the polymer substrate while the surface area of the polymer substrate is swollen, to form a plating film on the polymer substrate. |