| abstract |
The present invention relates to formation of a feedthrough associated with an implantable medical device. A conductive element is formed of at least one refractory metal. A portion of the conductive element is cladded with a noble metal. A portion of the noble metal clad is removed through an electrochemical process or through a grinding operation. Alternatively, noble metal is introduced to preselected areas of the conductive element, which avoids removal of a portion of the noble metal from the conductive element. |