| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2881
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2875 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-287
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate |
2007-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fc0d26b0a7b3a70a56b2f98504fcc74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62a4e5ef439ff7b1c4d4fab23acb8518 |
| publicationDate |
2007-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007259461-A1 |
| titleOfInvention |
Semiconductor wafer examination method and semiconductor chip manufacturing method |
| abstract |
A semiconductor wafer examination method that includes: preparing a wafer formed with a chip area for use as a semiconductor chip; firstly examining the wafer by probing; pressing an electrode of the wafer with a pressure member having a flat surface; and secondly examining the wafer by probing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8101435-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011151595-A1 |
| priorityDate |
2005-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |