http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007246158-A1

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filingDate 2006-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007246158-A1
titleOfInvention Wiring board, production process thereof and connection method using same
abstract The present invention provides a wiring board capable of realizing electrical connectivity even with connection leads having a fine pitch of 100 μm or less. The present invention relates to a wiring board with adhesive film comprising: a wiring board, in which the surface of a connection terminal portion on the end of a connection lead on the wiring board has a non-flat shape formed by a plating method; and, an adhesive film that covers the surface of the connection terminal portion and contains either a thermoplastic resin or a thermoplastic, thermosetting resin.
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