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publicationDate 2007-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007246133-A1
titleOfInvention Method for Electroplating and Contact Projection Arrangement
abstract A method for electroplating is provided in which a copper layer is patterned using a resist. A barrier layer lies below the copper layer and is used to supply the electroplating current in regions without the copper layer. The method makes it possible to produce high-quality soldering bumps.
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