| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b30a28e10d1fc36c4b9b26d0b05aff01 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0709
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1476
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-246
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09472
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0284 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-1258
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01K3-10 |
| filingDate |
2005-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51e0d327472713f58b616f1a0fd4b128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9591dc7791e51bf7a82e039c456c41a2 |
| publicationDate |
2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007220744-A1 |
| titleOfInvention |
Wiring Circuit Board Producing Method and Wiring Circuit Board |
| abstract |
A wiring circuit board and a method of producing the same are provided in which a desired pattern of wiring is provided at higher density while permitting no overflow from the grooves of an electroless plating catalyst containing solution and an electric conductor forming liquid such as silver ink. n The pattern of electric conductor is deposited by applying the electric conductor forming liquid into the grooves provided in a substrate and distributing the same along the grooves with the action of capillarity. The method starts with patterning the grooves in the surface of the substrate (S 1 ), applying the electric conductor forming liquid into the grooves (S 2 ), and coating the surface of the substrate with a layer of repellent liquid which is lower in the affinity with the electric conductor forming liquid (S 3 ). This is followed by cleaning at least the grooves (S 4 ) and then filling the grooves with the electric conductor forming liquid once again (S 5 ). The electric conductor forming liquid applied into the grooves is then distributed throughout the grooves by the action of capillarity. When silver ink is used, the pattern of electric conductor is produced by repeating an action of applying and drying a number of times. Alternatively, the patter of electric conductor can be produced by an electroless plating technique or a combination of an electroless plating technique and an electro-plating technique for separating an electrical conductive material form the electric conductor forming liquid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010078811-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016167389-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011111182-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015068787-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019171214-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011100957-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8499446-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010002519-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102170757-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9603257-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8703232-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10667387-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102137548-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007216436-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009010208-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112566365-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8985734-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018206594-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11011484-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007222079-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020157154-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011272286-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8652345-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113068311-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9832882-B2 |
| priorityDate |
2005-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |