| abstract |
An interconnect substrate includes an interconnect, an insulating layer, a non-photosensitive resin layer, a photosensitive resin layer, a first electrode pad, and a second electrode pad. The non-photosensitive resin layer is constructed with a non-photosensitive insulating material. Also, the non-photosensitive resin layer has a first opening. The photosensitive resin layer is constructed with a photosensitive insulating material. Also, the photosensitive resin layer has a second opening. The opening area of the second opening is larger than that of the first opening. The first electrode pad is disposed on the first surface side of the insulating layer. The first electrode pad is exposed to the first opening. The second electrode pad is disposed on the second surface side of the insulating layer. The second electrode pad is exposed to the second opening. |