| abstract |
A photosensitive resin composition for a laser engravable printing substrate, comprising resin (a) having a polymerizable unsaturated group whose number average molecular weight is in the range of 1000 to 20×10 4 , organic compound (b) having a polymerizable unsaturated group whose number average molecular weight is <1000 and organosilicon compound (c) having at least one Si—O bond in each molecule and having no polymerizable unsaturated group in molecules, wherein the content of organosilicon compound (c) is in the range of 0.1 to 10 wt. % based on the whole of photosensitive resin composition. |