| abstract |
The present invention provides a cobalt-based alloy electroless plating solution comprising a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complexing agent, a pH regulator and a stabilizer, in which the reducing agent is dimethylamine borane (DMAB) or borohydride and the stabilizer is one or more compounds selected from a group consisting of imidazole, thiazole, triazole, disulfide and their derivatives; and an electroless plating method using the cobalt-based alloy electroless plating solution, as well as a thin film prepared by the same. According to the present invention, the cobalt-based alloy electroless plating solution is stable enough for long-term reuse and prevents deterioration of metal thin-film quality by inhibiting the formation of a precipitate. The present invention further provides an electroless plating method using the cobalt-based alloy electroless plating solution, and a cobalt-based alloy thin film prepared by the same. |