Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R2201-20 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-523 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2808 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2414 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07328 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0408 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-24 |
filingDate |
2005-02-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_35ec15ada6ccb53d43abb1184878d4a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b063c1f4da9c9806521aaeaebd2c511c |
publicationDate |
2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2007159200-A1 |
titleOfInvention |
Adapter for circuit board examination and device for circuit board examination |
abstract |
An adaptor for inspection of circuit boards includes a wiring board for connection, on a front surface of which a plurality of connecting electrodes are formed correspondingly to electrodes to be inspected, and an anisotropically conductive elastomer sheet detachably arranged on the front surface of the wiring board for connection. The anisotropically conductive elastomer sheet has a surface roughness of 0.5 to 5 μm on its front surface coming into contact with the circuit board, and a surface roughness of at most 0.3 μm on its back surface coming into contact with the wiring board for connection. The wiring board for connection has, on its front surface, an insulating layer formed such that each of the connecting electrodes is exposed, and the insulating layer has a surface roughness of at most 0.2 μm on its front surface. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022132715-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10209275-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012146040-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102628878-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8729397-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012085569-A1 |
priorityDate |
2004-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |