| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0338 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03C1-00 |
| filingDate |
2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b16f9f4af839d45e9a8bd8fc92fe43a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_befe4f2c5b95bd7f3367e4d216f541c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f93a3ffcca30a818e931fd1861f583da
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6983ea677bd14871ebdce9e741f7076 |
| publicationDate |
2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007148588-A1 |
| titleOfInvention |
Methods of releasing photoresist film from substrate and bonding photoresist film with second substrate |
| abstract |
Disclosed herein is a method of releasing a photoresist film from a substrate, which includes forming a self-assembled monolayer (SAM) on a substrate; coating the SAM with a photoresist film; and rinsing the substrate with an alcohol or an acid. According to the photoresist film releasing method, a photoresist film can be easily released from a substrate without damage after patterning. A method of bonding a released photoresist film with a substrate includes arraying a second substrate and the photoresist film released from a first substrate, and baking the second substrate. According to the bonding method, the photoresist film can be perfectly bonded with a second substrate without generating a crevice even though an additional adhesive is not used. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009302460-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010173436-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007160502-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9249315-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7927904-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9023166-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11508908-B2 |
| priorityDate |
2005-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |