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filingDate 2006-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007145602-A1
titleOfInvention Structure Combining an IC Integrated Substrate and a Carrier, and Method of Manufacturing such Structure
abstract The present invention provides a structure combining an IC integrated substrate and a carrier, which comprises a carrier and an IC integrated substrate formed on the carrier. The interface between the IC integrated substrate and the carrier has a specific area at which the interface adhesion is different from that at the remaining area of the interface. The present invention also provides a method of manufacturing the above structure and a method of manufacturing electronic devices using the above structure.
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Total number of triples: 52.