| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-05 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate |
2004-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c01ff7d1f702d2f10a53ca35590a6081
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1f282fc65a063276a10c1793c4efcc81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12cbcea12fd39182bfa0734d0939bd1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb2be707f5cc72d29cabf3165f0ac1a4 |
| publicationDate |
2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2007135543-A1 |
| titleOfInvention |
Hot melt adhesive composition |
| abstract |
[Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300° C., and has a melting temperature width of not more than 30° C. and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9269603-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11130890-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018044562-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010176650-A1 |
| priorityDate |
2003-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |