Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b554d9058af14b5ea32a016c27b85e0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cc76bb6e9496c6681c71bd3cc3486d9a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e14767d4e2c74f86a680aaf25d8c51df |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1607 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1637 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2007-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_685ac2184a5c088353355a651541c1fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234ede66ef331f4974e97759d4e12455 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ebf43d3262c75e212c395c7c4847efc |
publicationDate |
2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2007132105-A1 |
titleOfInvention |
Selective activation of aluminum, copper, and tungsten structures |
abstract |
A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009203210-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8071482-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11728258-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9277653-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8263497-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009206488-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011129996-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012193135-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7981804-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11257745-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7898063-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010178766-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8586465-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10446440-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009176362-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009261458-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8647982-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9640433-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008293240-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8766107-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010081767-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012200346-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014123489-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492901-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-101504931-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008303163-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10062608-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8658911-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8072046-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8741762-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011108958-A1 |
priorityDate |
2004-09-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |